<p>Our new&nbsp;<strong>VLIS</strong>&nbsp;(<strong>V</strong>olume<strong>&nbsp;L</strong>aser&nbsp;<strong>I</strong>nduced<strong>&nbsp;S</strong>tructuring) process enables the fabrication of high-precision TGV ("Through Glass Vias") for advanced packaging in glass/quartz wafers, or substrates for displays.</p><p><br></p><p>TGV are micro-holes with a diameter of typically 10µm to 100µm. For various applications in the advanced packaging sector, tens of thousands of these vias are deposited per wafer and metallized to produce the required conductivity. TGVs are also used in the manufacture of displays, for example based on µLED. Previous methods for manufacturing were slow, associated with high reject rates and difficult to match to the metallization process.</p>
<p>Game Changing Speed and Precision</p>
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